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Solder Materials (Wspc Series In Advanced Integration And Packaging, Vol. 6) '18

Lin, Kwang-Lung  著

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発行年月 2018年07月
出版社/提供元
出版国 シンガポール
言語 英語
媒体 冊子
装丁 hardcover
ページ数/巻数 388 p.
ジャンル 洋書/理工学/材料科学/電子材料(無機系)
ISBN 9789813237605
商品コード 1027050471
新刊案内掲載月 2018年06月
商品URL
参照
https://kw.maruzen.co.jp/ims/itemDetail.html?itmCd=1027050471

内容

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

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