【エンジニアのための材料科学入門 第7版 ISE版】
Introduction to Materials Science for Engineers. 7th ed./ISE. paper 600 p.
Shackelford, James F. 著
目次
1 Materials for Engineering 1 1.1 The Material World 1 1.2 MaterialsScience and Engineering 2 1.3 Six Materials That Changed Your World 3 STEELBRIDGES--INTRODUCING METALS 3 LUCALOX LAMPS--INTRODUCING CERAMICS 5 OPTICALFIBERS--INTRODUCING GLASSES 9 NYLON PARACHUTES--INTRODUCING POLYMERS 11KEVLAR(R)-REINFORCED TIRES--INTRODUCING COMPOSITES 13 SILICONCHIPS--INTRODUCING SEMICONDUCTORS 14 1.4 Processing and Selecting Materials15 1.5 Looking at Materials by Powers of Ten 17 PART I The Fundamentals 2Atomic Bonding 22 2.1 Atomic Structure 22 2.2 The Ionic Bond 28COORDINATION NUMBER 32 2.3 The Covalent Bond 39 2.4 The Metallic Bond 452.5 The Secondary, or van der Waals, Bond 47 2.6 Materials--The BondingClassification 50 3 Crystalline Structure--Perfection 58 3.1 Seven Systemsand Fourteen Lattices 58 3.2 Metal Structures 62 3.3 Ceramic Structures 663.4 Polymeric Structures 74 3.5 Semiconductor Structures 76 3.6 LatticePositions, Directions, and Planes 80 3.7 X-Ray Diffraction 92 4 CrystalDefects and Noncrystalline Structure--Imperfection 102 4.1 The SolidSolution--Chemical Imperfection 102 4.2 Point Defects--Zero-DimensionalImperfections 108 4.3 Linear Defects, or Dislocations--One-DimensionalImperfections 110 4.4 Planar Defects--Two-Dimensional Imperfections 1134.5 Noncrystalline Solids--Three-Dimensional Imperfections 118 5 Diffusion126 5.1 Thermally Activated Processes 126 5.2 Thermal Production of PointDefects 130 5.3 Point Defects and Solid-State Diffusion 132 5.4Steady-State Diffusion 142 5.5 Alternate Diffusion Paths 146 6 MechanicalBehavior 152 6.1 Stress Versus Strain 152 METALS 153 CERAMICS AND GLASSES164 POLYMERS 168 6.2 Elastic Deformation 173 6.3 Plastic Deformation 1746.4 Hardness 181 6.5 Creep and Stress Relaxation 185 6.6 ViscoelasticDeformation 193 INORGANIC GLASSES 194 ORGANIC POLYMERS 196 ELASTOMERS 1997 Thermal Behavior 210 7.1 Heat Capacity 210 7.2 Thermal Expansion 213 7.3Thermal Conductivity 216 7.4 Thermal Shock 221 8 Failure Analysis andPrevention 227 8.1 Impact Energy 228 8.2 Fracture Toughness 233 8.3Fatigue 237 8.4 Nondestructive Testing 246 8.5 Failure Analysis andPrevention 249 9 Phase Diagrams--Equilibrium Microstructural Development257 9.1 The Phase Rule 258 9.2 The Phase Diagram 261 COMPLETE SOLIDSOLUTION 262 EUTECTIC DIAGRAM WITH NO SOLID SOLUTION 265 EUTECTIC DIAGRAMWITH LIMITED SOLID SOLUTION 267 EUTECTOID DIAGRAM 269 PERITECTIC DIAGRAM271 GENERAL BINARY DIAGRAMS 275 9.3 The Lever Rule 281 9.4 MicrostructuralDevelopment During Slow Cooling 285 10 Kinetics--Heat Treatment 304 10.1Time--The Third Dimension 304 10.2 The T T T Diagram 309 DIFFUSIONALTRANSFORMATIONS 310 DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS 311 HEATTREATMENT OF STEEL 316 10.3 Hardenability 324 10.4 Precipitation Hardening327 10.5 Annealing 330 COLD WORK 331 RECOVERY 331 RECRYSTALLIZATION 332GRAIN GROWTH 334 10.6 The Kinetics of Phase Transformations for Nonmetals335 PART II Materials and Their Applications 11 StructuralMaterials--Metals, Ceramics, and Glasses 348 11.1 Metals 348 FERROUSALLOYS 348 NONFERROUS ALLOYS 355 11.2 Ceramics and Glasses 359CERAMICS--CRYSTALLINE MATERIALS 360 GLASSES--NONCRYSTALLINE MATERIALS 361GLASS-CERAMICS 363 11.3 Processing the Structural Materials 365 PROCESSINGOF METALS 366 PROCESSING OF CERAMICS AND GLASSES 372 12 StructuralMaterials--Polymers and Composites 381 12.1 Polymers 381 POLYMERIZATION382 STRUCTURAL FEATURES OF POLYMERS 387 THERMOPLASTIC POLYMERS 391THERMOSETTING POLYMERS 392 ADDITIVES 394 12.2 Composites 396FIBER-REINFORCED COMPOSITES 396 AGGREGATE COMPOSITES 403 PROPERTY AVERAGING405 MECHANICAL PROPERTIES OF COMPOSITES 411 12.3 Processing the StructuralMaterials 416 PROCESSING OF POLYMERS 416 PROCESSING OF COMPOSITES 417 13Electronic Materials 426 13.1 Charge Carriers and Conduction 427 13.2Energy Levels and Energy Bands 431 13.3 Conductors 437 THERMOCOUPLES 440SUPERCONDUCTORS 441 13.4 Insulators 449 13.5 Semiconductors 451 INTRINSIC,ELEMENTAL SEMICONDUCTORS 452 EXTRINSIC, ELEMENTAL SEMICONDUCTORS 457COMPOUND SEMICONDUCTORS 469 PROCESSING OF SEMICONDUCTORS 472 SEMICONDUCTORDEVICES 476 13.6 Composites 485 13.7 Electrical Classification of Materials485 14 Materials in Engineering Design 493 14.1 MaterialProperties--Engineering Design Parameters 493 14.2 Selection of StructuralMaterials--Case Studies 498 MATERIALS FOR WINDSURFER MASTS 499 METALSUBSTITUTION WITH COMPOSITES 503 MATERIALS FOR HIP-JOINT REPLACEMENT 50314.3 Selection of Electronic Materials--Case Studies 506 AMORPHOUS METALFOR ELECTRIC-POWER DISTRIBUTION 507 LIGHT-EMITTING DIODE 511 14.4Materials and Our Environment 514 ENVIRONMENTAL DEGRADATION OF MATERIALS 514ENVIRONMENTAL ASPECTS OF DESIGN 523 RECYCLING 526 APPENDIX ONE Physicaland Chemical Data for the Elements A-1 APPENDIX TWO Atomic and Ionic Radiiof the Elements A-4 APPENDIX THREE Constants and Conversion Factors A-7APPENDIX FOUR Properties of the Structural Materials A-8 APPENDIX FIVEProperties of the Electronic Materials A-17 APPENDIX SIX Glossary A-20Answers to Practice Problems (PP) and Odd-Numbered Problems AN-1 Index I-1
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