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【江刺 正喜 編 MEMSの3D化と回路の統合】

3D and Circuit Integration of MEMS H 528 p. 21

Esashi, Masayoshi  編
在庫状況 海外在庫有り  お届け予定日 20日間  数量 冊 
価格 特価  \26,896(税込)         

発行年月 2021年04月
出版社/提供元
出版国 ドイツ
言語 英語
媒体 冊子
装丁 hardcover
ページ数/巻数 528 p.
ジャンル 洋書/理工学/電気電子工学/電子デバイス・回路・システム
ISBN 9783527346479
商品コード 1028656411
本の性格 学術書
新刊案内掲載月 2020年10月
商品URL
参照
https://kw.maruzen.co.jp/ims/itemDetail.html?itmCd=1028656411

著者紹介

Esashi, Masayoshi(編者):東北大学材料科学高等研究所

内容

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems

MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.

You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.

Readers will also benefit from the inclusion of:

・A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices
・An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si
・Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe
・A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters

Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

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